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This method outlines the requirements, capabilities, and limitations associated with the application of Design Recovery for the detection of counterfeit electronic parts including: Operator training; Sample preparation; Imaging techniques; Data interpretation; Design/functional matching; Equipment maintenance and; Reporting of data. The method is primarily aimed at analyses performed by circuit delayering and imaging with a scanning electron microscope or optical microscope; however, many of the concepts are applicable to other microscope and probing techniques to recover design data. The method is not intended for the purpose of manufacturing copies of a device, but rather to compare images or recover the design for determination of authenticity. If AS6171/11 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used. If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

To define capabilities and limitations of Raman spectroscopy as it pertains to counterfeit detection of EEE parts and suggest possible applications to these ends. Additionally, this document outlines requirements associated with the application of Raman spectroscopy including: Operator training; Sample preparation; Data interpretation; Computerized spectral matching including pass/fail criteria; Equipment maintenance and; Reporting of data. If AS6171/8 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This method outlines the requirements, capabilities, and limitations associated with the application of Design Recovery for the detection of counterfeit electronic parts including: Operator training; Sample preparation; Imaging techniques; Data interpretation; Design/functional matching; Equipment maintenance and; Reporting of data. The method is primarily aimed at analyses performed by circuit delayering and imaging with a scanning electron microscope or optical microscope; however, many of the concepts are applicable to other microscope and probing techniques to recover design data. The method is not intended for the purpose of manufacturing copies of a device, but rather to compare images or recover the design for determination of authenticity. If AS6171/11 is invoked in the contract, the base document, AS6171 General Requirements shall also apply. SAE Counterfeit Defect Coverage Tool

Through the use of ultra-high frequency ultrasound, typically above 10 MHz, Acoustic Microscopy (AM) non-destructively finds and characterizes physical features and latent defects (visualization of interior features in a layer by layer process) - such as material continuity and discontinuities, sub-surface flaws, cracks, voids, delaminations and porosity. AM observed features and defects can be indicators that the components were improperly handled, stored, altered or previously used. If AS6171/6 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.

This document describes an assessment of the effectiveness of a specified test plan used to screen for counterfeit parts. The assessment includes the determination of the types of defects detected using a specified test plan along with the related counterfeit type coverage. The output of this evaluation will produce Counterfeit Defect Coverage (CDC), Counterfeit Type Coverage (CTC), Not-Covered Defects (NCDs), and Under-Covered Defects (UCDs). This information will be supplied to the test laboratory’s customer in both the test report and the Certificate of Quality Conformance (CoQC). This evaluation method does not address the effectiveness of detecting tampered type devices. The Test Evaluation Method also describes an Optimized Test Sequence Selection, in which a test sequence is selected that maximizes the CDC utilizing test cost and time as constraints, for any tier level except the Critical Risk Level. The constraints can be adjusted until the desired CDC is achieved.

This document describes an assessment of the effectiveness of a specified test plan used to screen for counterfeit parts. The assessment includes the determination of the types of defects detected using a specified test plan along with the related counterfeit type coverage. The output of this evaluation will produce Counterfeit Defect Coverage (CDC), Counterfeit Type Coverage (CTC), Not-Covered Defects (NCDs), and Under-Covered Defects (UCDs). This information will be supplied to the test laboratory’s customer in both the test report and the Certificate of Quality Conformance (CoQC). This evaluation method does not address the effectiveness of detecting tampered type devices. The Test Evaluation Method also describes an Optimized Test Sequence Selection, in which a test sequence is selected that maximizes the CDC utilizing test cost and time as constraints, for any tier level except the Critical Risk Level. The constraints can be adjusted until the desired CDC is achieved.

This document contains a list of EVI tests that can be specified by the Requester to detect Suspect/Counterfeit EEE Parts. The following EVI tests described in this document are listed in 3.4 of AS6171 General Requirements: Method A: General EVI Method B: Detailed EVI, including Part Weight Measurement Method C: Testing for Remarking Method D: Testing for Resurfacing Method E: Part Dimensions Measurement When the SOW or the PO includes Part Packaging test(s) (refer to AS6171/15), the Responsible Test Laboratory (RTL) shall ensure that the Part Packaging test(s) are completed prior to starting the EVI test(s). This document is focused on EEE parts (herein may be referred to as “EEE parts” or “parts”). Although the examples in this document focus on microcircuits, this document applies to all EEE parts listed in the Applicability Matrix (Appendix A of AS6171 General Requirements).

This document describes the requirements of the following test methods for counterfeit detection of electronic components: a Method A: General External Visual Inspection (EVI), Sample Selection, and Handling b Method B: Detailed EVI c Method C: Testing for Remarking and Resurfacing d Method D: Surface Texture Analysis by SEM NOTE: The scope of this document was focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other electronic components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide but additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types.

This document describes the requirements of the following test methods for counterfeit detection of electronic components: a Method A: General EVI, Sample Selection, and Handling b Method B: Detailed EVI, including Part Weight measurement c Method C: Testing for Remarking d Method D: Testing for Resurfacing e Method E: Part Dimensions measurement f Method F: Surface Texture Analysis using SEM The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.